Patent Assignment
Reel/Frame 046167/0663
Assignment of Assignor's Interest
Recorded: 2018-06-21
Pages: 7
Assignors
KIM, HUI-JUNG
Executed: 2018-05-23
HAN, SUNG-HEE
Executed: 2018-05-23
LEE, KI-SEOK
Executed: 2018-05-23
KIM, BONG-SOO
Executed: 2018-05-23
HWANG, YOO-SANG
Executed: 2018-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including a Support Pattern, a Lower Electrode Pattern, a Dielectric Structure, and an Upper Electrode Structure