IP Library › Assignment 046173/0597
Patent Assignment
Reel/Frame 046173/0597

Assignment of Assignor's Interest

Recorded: 2018-06-22 Pages: 7
Assignors
HWANG, INCHAN
Executed: 2018-05-15
SHIN, HEONJONG
Executed: 2018-05-15
JUNG, SUNGHUN
Executed: 2018-05-15
LEE, DOOHYUN
Executed: 2018-05-15
JUN, HWICHAN
Executed: 2018-05-15
AHN, HAKYOON
Executed: 2018-05-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Having Silicides and Methods of Manufacturing the Same
Application: 16/014,496 →
Publication: US 2019/0157406