Patent Assignment
Reel/Frame 046186/0576
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 3
Assignors
ESTACIO, MARIA CRISTINA
Executed: 2018-06-25
CABAHUG, ELSIE AGDON
Executed: 2018-06-25
MANATAD, ROMEL N.
Executed: 2018-06-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device Package with Clip Interconnect and Dual Side Cooling
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Oct 16, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047864/0611 →
Release of Security Interest in Patents Recorded at Reel 047864, Frame 0611
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064077/0298 →