Patent Assignment
Reel/Frame 046191/0703
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 10
Assignors
ZHAO, SAM ZIQUN
Executed: 2016-07-06
KARIKALAN, SAM KOMARAPALAYAM
Executed: 2016-07-28
LAW, EDWARD
Executed: 2016-07-06
KHAN, REZAUR RAHMAN
Executed: 2016-07-08
VORENKAMP, PIETER
Executed: 2016-07-08
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
Thin Recon Interposer Package Without Tsv for Fine Input/Output Pitch Fan-Out
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2018
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 046191/0734 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
Corrective Assignment to Correct the Execution Date of the Merger and Application Nos. 13/237,550 and 16/103,107 from the Merger Previously Recorded on Reel 047231 Frame 0369. Assignor(S) Hereby Confirms the Merger.
Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →