Patent Assignment
Reel/Frame 046191/0734
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 3
Assignor
BROADCOM CORPORATION
Executed: 2017-01-20
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
I YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property
(1)
Thin Recon Interposer Package Without Tsv for Fine Input/Output Pitch Fan-Out
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2018
From: ZHAO, SAM ZIQUN; KARIKALAN, SAM KOMARAPALAYAM; LAW, EDWARD; KHAN, REZAUR RAHMAN
To: BROADCOM CORPORATION
Reel/Frame 046191/0703 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
Corrective Assignment to Correct the Execution Date of the Merger and Application Nos. 13/237,550 and 16/103,107 from the Merger Previously Recorded on Reel 047231 Frame 0369. Assignor(S) Hereby Confirms the Merger.
Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →