Patent Assignment
Reel/Frame 046191/0928
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 3
Assignors
JUNG, YEON SEUNG
Executed: 2018-06-15
KIM, JONG HOON
Executed: 2018-06-15
PARK, JIN WOO
Executed: 2018-06-15
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Relating to Thermal Transfer Plate and Methods of Manufacturing the Same