Patent Assignment
Reel/Frame 046196/0040
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 7
Assignors
BAE, DEOK-HAN
Executed: 2018-03-31
KIM, SANG-YOUNG
Executed: 2018-03-31
RYU, BYUNG-CHAN
Executed: 2018-03-31
YOU, JONG-HO
Executed: 2018-03-31
JEON, DA-UN
Executed: 2018-04-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing Same