Patent Assignment
Reel/Frame 046207/0756
Corrective Assignment to Correct the Fourth and Fifth Assignor's Execution Date Previously Recorded on Reel 045862 Frame 0195. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2018-05-22
Pages: 5
Assignors
MURAKAMI, YASUHARU
Executed: 2014-07-01
YAMAZAKI, HIROSHI
Executed: 2014-07-01
IGARASHI, YOSHIMI
Executed: 2014-07-01
SASAHARA, NAOKI
Executed: 2014-06-24
MUKAI, IKUO
Executed: 2014-06-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 21, 2018
From: MURAKAMI, YASUHARU; YAMAZAKI, HIROSHI; IGARASHI, YOSHIMI; SASAHARA, NAOKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045862/0195 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →