Patent Assignment
Reel/Frame 046209/0393
Assignment of Assignor's Interest
Recorded: 2018-06-27
Pages: 6
Assignors
JENG, SHIN-PUU
Executed: 2018-04-16
CHEN, DAI-JANG
Executed: 2018-04-23
LU, HSIANG-TAI
Executed: 2018-04-23
LIU, HSIEN-WEN
Executed: 2018-03-30
LIN, CHIH-HSIEN
Executed: 2018-04-23
HUNG, SHIH-TING
Executed: 2018-03-30
CHUANG, PO-YAO
Executed: 2018-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Packages