Patent Assignment
Reel/Frame 046219/0073
Assignment of Assignor's Interest
Recorded: 2018-06-27
Pages: 11
Assignors
VADHAVKAR, SAMEER S.
Executed: 2014-07-09
LI, XIAO
Executed: 2014-07-09
GROOTHUIS, STEVEN K.
Executed: 2014-07-11
LI, JIAN
Executed: 2014-07-09
GANDHI, JASPRETT S.
Executed: 2014-07-09
DERDERIAN, JAMES M.
Executed: 2014-07-09
HEMBREE, DAVID R.
Executed: 2014-07-09
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Manufacturing Stacked Semiconductor Die Assemblies with High Efficiency Thermal Paths
Application:
16/020,567 →
Publication:
US 2018/0308785
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →