Patent Assignment
Reel/Frame 046222/0371
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 6
Assignors
LIU, TZUAN-HORNG
Executed: 2018-05-23
CHEN, HSIEN-WEI
Executed: 2018-05-23
WANG, JIUN-HENG
Executed: 2018-05-29
CHEN, MING-FA
Executed: 2018-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3DIC Structure and Method of Manufacturing the Same