Patent Assignment
Reel/Frame 046222/0477
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 4
Assignors
YEH, SUNG-FENG
Executed: 2018-05-29
CHEN, HSIEN-WEI
Executed: 2018-05-29
CHEN, MING-FA
Executed: 2018-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
3DIC Structure and Method of Manufacturing the Same