3DIC structure and method of manufacturing the same
A 3DIC structure includes a die, a conductive terminal, and a dielectric structure. The die is bonded to a carrier through a bonding film. The conductive terminal is disposed over and electrically connected to the die. The dielectric structure comprises a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed laterally aside the die. The second dielectric layer is disposed between the first dielectric layer and the bonding film, and between the die and the boding film. A second edge of the second dielectric layer is more flat than a first edge of the first dielectric layer.
1. A 3DIC structure, comprising:
a die bonding to a carrier through a bonding film;
a conductive terminal disposed over and electrically connected to the die,
a dielectric structure comprising:
a first dielectric layer disposed laterally aside the die; and
a second dielectric layer disposed between the first dielectric layer and the bonding film, and between the die and the boding film,
wherein a second edge of the second dielectric layer is more flat than a first edge of the first dielectric layer,
wherein a first corner of the first dielectric layer comprises a first rounding portion, a second corner of the second dielectric layer comprises a second rounding portion; and
a width of the second rounding portion is less than a width of the first rounding portion, a height of the second rounding portion is less than a height of the first rounding portion.
2. The 3DIC structure of claim 1 , wherein the width and the height of the second rounding portion are zero, and the second corner is a right angle.
3. The 3DIC structure of claim 1 , wherein a length of the second rounding portion is less than a length of the first rounding portion.
4. The 3DIC structure of claim 1 , wherein the first rounding portion of the first dielectric layer is covered by the second dielectric layer, and a portion of the second dielectric layer is located laterally aside the first dielectric layer.
5. The 3DIC structure of claim 4 , wherein a thickness of the second dielectric layer on the first corner of the first dielectric layer is larger than a thickness of the second dielectric layer on the die.
6. The 3DIC structure of claim 1 , wherein
an interface is between the first dielectric layer and the second dielectric layer;
a portion of the interface is coplanar with a surface of the die; and
an end portion of the interface is not coplanar with the surface of the die, and is laterally aside the die.
7. The 3DIC structure of claim 1 , wherein a ratio of a contact area between the bonding film and the carrier to an area of the carrier facing the bonding film ranges from 0.99 to 1.
8. The 3DIC structure of claim 1 , wherein a corner of the die comprises a third rounding portion, and a width of the third rounding portion ranges from 0 to 0.4 μm.
9. The 3DIC structure of claim 1 , further comprising a redistribution layer (RDL) structure between the die and the conductive terminal.
10. A 3DIC structure, comprising:
a die bonding to a carrier through a bonding film;
a conductive terminal disposed over and electrically connected to the die,
a dielectric structure comprising:
a first dielectric layer disposed laterally aside the die; and
a second dielectric layer disposed between the first dielectric layer and the bonding film, and between the die and the boding film,
wherein a second edge of the second dielectric layer is more flat than a first edge of the first dielectric layer,
wherein a ratio of a contact area between the bonding film and the carrier to an area of the carrier facing the bonding film ranges from 0.99 to 1.
11. The 3DIC structure of claim 10 , wherein a first corner of the first dielectric layer comprises a first rounding portion, a second corner of the second dielectric layer comprises a second rounding portion.
12. The 3DIC structure of claim 11 , wherein a length of the second rounding portion is less than a length of the first rounding portion.
13. The 3DIC structure of claim 11 , wherein the first rounding portion of the first dielectric layer is covered by the second dielectric layer, and a portion of the second dielectric layer is located laterally aside the first dielectric layer.
14. The 3DIC structure of claim 10 , wherein
an interface is between the first dielectric layer and the second dielectric layer;
a portion of the interface is coplanar with a surface of the die; and
an end portion of the interface is not coplanar with the surface of the die, and is laterally aside the die.
15. A 3DIC structure, comprising:
a die bonding to a carrier through a bonding film;
a conductive terminal disposed over and electrically connected to the die,
a dielectric structure comprising:
a first dielectric layer disposed laterally aside the die; and
a second dielectric layer disposed between the first dielectric layer and the bonding film, and between the die and the boding film,
wherein a second edge of the second dielectric layer is more flat than a first edge of the first dielectric layer,
wherein a corner of the die comprises a rounding portion, and a width of the rounding portion ranges from 0 to 0.4 μm.
16. The 3DIC structure of claim 15 , wherein
a first corner of the first dielectric layer comprises a first rounding portion; and
a second corner of the second dielectric layer is a right angle.
17. The 3DIC structure of claim 16 , wherein a thickness of the second dielectric layer on the first corner of the first dielectric layer is larger than a thickness of the second dielectric layer on the die.
18. The 3DIC structure of claim 16 , wherein the first rounding portion of the first dielectric layer is covered by the second dielectric layer, and a portion of the second dielectric layer is located laterally aside the first dielectric layer.
19. The 3DIC structure of claim 15 , wherein
an interface is between the first dielectric layer and the second dielectric layer;
a portion of the interface is coplanar with a surface of the die; and
an end portion of the interface is not coplanar with the surface of the die, and is laterally aside the die.