Patent Assignment
Reel/Frame 046229/0001
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 7
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MS 1- 525, BOISE, IDAHO, 83716
Covered Property
(1)
Elevationally-Elongated Conductive Structure Of Integrated Circuitry, Method Of Forming An Array Of Capacitors, Method Of Forming DRAM Circuitry, And Method Of Forming An Elevationally-Elongated Conductive Structure Of Integrated Circuitry
Patent:
10,461,149 →
Application:
16/021,683 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →