Patent Assignment
Reel/Frame 046234/0375
Assignment of Assignor's Interest
Recorded: 2018-06-28
Pages: 4
Assignors
PHILLIPS, RICHARD
Executed: 2017-10-05
BALDASSERONI, CHLOE
Executed: 2017-10-09
MANJUNATH, NISHANTH
Executed: 2017-10-12
Assignee
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Thickness Compensation by Modulation of Number of Deposition Cycles as a Function of Chamber Accumulation for Wafer to Wafer Film Thickness Matching