Patent Assignment
Reel/Frame 046240/0509
Assignment of Assignor's Interest
Recorded: 2018-06-29
Pages: 8
Assignors
SEYEDI, ASHKAN
Executed: 2018-06-27
FIORENTINO, MARCO
Executed: 2018-06-27
KURCZVEIL, GEZA
Executed: 2018-06-27
BEAUSOLEIL, RAYMOND G.
Executed: 2018-06-27
Assignee
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
11445 COMPAQ CENTER DRIVE WEST, HOUSTON, TEXAS, 77070
Covered Property
(1)
Laser Assembly Packaging for Silicon Photonic Interconnects