Patent Assignment
Reel/Frame 046248/0160
Assignment of Assignor's Interest
Recorded: 2018-05-25
Pages: 4
Assignors
OTSUKA, YOSHITAKA
Executed: 2018-05-11
KODAMA, MUNEHISA
Executed: 2018-05-11
TERADA, TAKASHI
Executed: 2018-05-11
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Manufacturing Method of Substrate Holding Unit