Patent Assignment
Reel/Frame 046257/0897
Assignment of Assignor's Interest
Recorded: 2018-07-03
Pages: 2
Assignors
HUANG, CHENG-LIN
Executed: 2015-03-03
CHANG, JUNG-HUA
Executed: 2015-03-23
GAU, JY-JIE
Executed: 2015-03-23
LIN, JING-CHENG
Executed: 2015-03-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Non-Vertical Through-via in Package