Patent Assignment
Reel/Frame 046261/0642
Assignment of Assignor's Interest
Recorded: 2018-07-03
Pages: 6
Assignors
TAGUCHI, JUNNOSUKE
Executed: 2018-06-20
SASAKI, YUYA
Executed: 2018-06-20
CHIBA, TOSHIYA
Executed: 2018-06-21
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Warpage Detection Device, Substrate Warpage Detection Method, and Substrate Processing Apparatus and Substrate Processing Method Using the Same