Patent Assignment
Reel/Frame 046271/0381
Assignment of Assignor's Interest
Recorded: 2018-07-05
Pages: 6
Assignors
CHIBA, TOSHIYA
Executed: 2018-06-21
SASAKI, YUYA
Executed: 2018-06-20
TAGUCHI, JUNNOSUKE
Executed: 2018-06-20
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU, TOKYO, 1076325, JAPAN
Covered Property
(1)
Substrate Warping Monitoring Device and Substrate Processing Apparatus Using the Same, and Substrate Warping Monitoring Method