Patent Assignment
Reel/Frame 046274/0155
Assignment of Assignor's Interest
Recorded: 2018-07-05
Pages: 5
Assignors
XU, CHENG
Executed: 2018-06-26
JAIN, RAHUL
Executed: 2018-06-27
YOUNG KIM, SEO
Executed: 2018-06-26
LEE, KYU OH
Executed: 2018-06-26
PARK, JI YONG
Executed: 2018-06-26
VADLAMANI, SAI
Executed: 2018-06-26
ZHAO, JUNNAN
Executed: 2018-06-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package-Embedded Thin-Film Capacitors, Package-Integral Magnetic Inductors, and Methods of Assembling Same
Patent:
10,373,951 →
Application:
16/017,247 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.