Patent Assignment
Reel/Frame 046278/0155
Assignment of Assignor's Interest
Recorded: 2018-07-06
Pages: 9
Assignors
SANKMAN, ROBERT L
Executed: 2018-06-08
AGRAHARAM, SAIRAM
Executed: 2018-06-08
OU, SHENGQUAN
Executed: 2018-06-08
DE BONIS, THOMAS J
Executed: 2018-06-06
SPENCER, TODD
Executed: 2018-06-08
SUN, YANG
Executed: 2018-06-08
WANG, GUOTAO
Executed: 2018-06-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Chip Packaging