Patent Assignment
Reel/Frame 046295/0058
Assignment of Assignor's Interest
Recorded: 2018-07-09
Pages: 5
Assignors
CHEN, CHIH-LIANG
Executed: 2018-06-21
CHOU, LEI-CHUN
Executed: 2018-06-21
LIU, JACK
Executed: 2018-06-21
SIO, KAM-TOU
Executed: 2018-06-21
YANG, HUI-TING
Executed: 2018-06-22
LIN, WEI-CHENG
Executed: 2018-06-21
LIOU, CHUN-HUNG
Executed: 2018-06-21
TZENG, JIANN-TYNG
Executed: 2018-06-21
YOUNG, CHEW-YUEN
Executed: 2018-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Integrating Backside Power Grid and Related Integrated Circuit and Fabrication Method