Patent Assignment
Reel/Frame 046306/0520
Assignment of Assignor's Interest
Recorded: 2018-07-10
Pages: 3
Assignors
ZI, AN-REN
Executed: 2018-06-28
CHANG, CHING-YU
Executed: 2018-06-28
LIN, CHIN-HSIANG
Executed: 2018-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure by Patterning Assist Layer Having Polymer