Patent Assignment
Reel/Frame 046316/0355
Assignment of Assignor's Interest
Recorded: 2018-07-11
Pages: 7
Assignors
SHU, CHENG-BO
Executed: 2018-06-21
HUANG, CHUNG-JEN
Executed: 2018-06-21
WU, YUN-CHI
Executed: 2018-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Seal Method to Integrate Non-Volatile Memory (Nvm) into Logic or Bipolar Cmos Dmos (Bcd) Technology