Patent Assignment
Reel/Frame 046325/0487
Assignment of Assignor's Interest
Recorded: 2018-07-11
Pages: 4
Assignors
WU, KAI-CHIANG
Executed: 2018-05-15
PU, HAN-PING
Executed: 2018-05-15
WANG, YEN-PING
Executed: 2018-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof