Patent Assignment
Reel/Frame 046332/0137
Assignment of Assignor's Interest
Recorded: 2018-06-11
Pages: 5
Assignors
LEE, CHANG BO
Executed: 2018-05-28
OH, JOON SEOK
Executed: 2018-05-28
JUNG, HYUN CHUL
Executed: 2018-05-28
YEO, JEONG HO
Executed: 2018-05-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.