Patent Assignment
Reel/Frame 046341/0279
Assignment of Assignor's Interest
Recorded: 2018-07-13
Pages: 9
Assignors
TOSAKA, YUJI
Executed: 2018-06-12
SAITOH, TAKESHI
Executed: 2018-06-12
NAKAMURA, YUKIO
Executed: 2018-06-12
SASAKI, RYOHTA
Executed: 2018-06-12
SHIMIZU, HIROSHI
Executed: 2018-06-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Prepreg, Printed Circuit Board, Semiconductor Package, and Method for Producing Printed Circuit Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 27, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054221/0462 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →