Patent Assignment
Reel/Frame 046360/0015
Assignment of Assignor's Interest
Recorded: 2018-07-16
Pages: 2
Assignor
LEE, DAE WOONG
Executed: 2018-07-06
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Relating to Thermal Redistribution Patterns