Patent Assignment
Reel/Frame 046363/0516
Assignment of Assignor's Interest
Recorded: 2018-07-17
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure, Package-on-Package Structure and Manufacturing Method Thereof