IP Library Assignment 046374/0158
Patent Assignment
Reel/Frame 046374/0158

Assignment of Assignor's Interest

Recorded: 2018-07-17 Pages: 4
Assignors
LEE, SANG KYU
Executed: 2018-05-16
LEE, JEONG HO
Executed: 2018-05-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 16/037,670 →
Publication: US 2019/0131232
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →