Patent Assignment
Reel/Frame 046374/0233
Assignment of Assignor's Interest
Recorded: 2018-07-17
Pages: 4
Assignor
LEE, JAE KUL
Executed: 2018-05-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Sensor Package and Optical-Type Fingerprint Sensor Module Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.