Patent Assignment
Reel/Frame 046393/0609
Assignment of Assignor's Interest
Recorded: 2018-06-20
Pages: 26
Assignors
WU, TZU-CHIN
Executed: 2018-06-19
LIU, WEI-HSIN
Executed: 2018-06-19
CHEN, YI-WEI
Executed: 2018-06-19
CHANG, CHIA-LUNG
Executed: 2018-06-19
LEE, JUI-MIN
Executed: 2018-06-19
CHEN, PO-CHUN
Executed: 2018-06-19
FENG, LI-WEI
Executed: 2018-06-19
WANG, YING-CHIAO
Executed: 2018-06-19
LU, WEN-CHIEH
Executed: 2018-06-19
HO, CHIEN-TING
Executed: 2018-06-19
TSAI, TSUNG-YING
Executed: 2018-06-19
CHEN, KAI-PING
Executed: 2018-06-19
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Memory Device and Manufacturing Method Thereof