Patent Assignment
Reel/Frame 046395/0476
Assignment of Assignor's Interest
Recorded: 2018-07-19
Pages: 3
Assignor
GUANZON, JOBELITO ANJAO
Executed: 2018-05-31
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property
(1)
Bond Pad and Clip Configuration for Packaged Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.