Patent Assignment
Reel/Frame 046589/0699
Assignment of Assignor's Interest
Recorded: 2018-07-19
Pages: 3
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Bond Pad and Clip Configuration for Packaged Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.