Patent Assignment
Reel/Frame 046395/0907
Assignment of Assignor's Interest
Recorded: 2018-06-20
Pages: 10
Assignors
GAMBEE, CHRISTOPHER J.
Executed: 2018-06-19
DOAN, NHI
Executed: 2018-06-20
TIWARI, CHANDRA S.
Executed: 2018-06-19
FAY, OWEN R.
Executed: 2018-06-19
CHEN, YING
Executed: 2018-06-19
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods for Enhancing Adhesion of Three-Dimensional Structures to Substrates
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement
Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest
Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →