Patent Assignment
Reel/Frame 046400/0748
Assignment of Assignor's Interest
Recorded: 2018-07-19
Pages: 3
Assignors
YANG, YI
Executed: 2018-05-30
SHEN, DONGNA
Executed: 2018-05-31
WANG, YU-JEN
Executed: 2018-05-31
Assignee
HEADWAY TECHNOLOGIES, INC
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Under-Cut Via Electrode for Sub 60nm Etchless MRAM Devices by Decoupling the Via Etch Process
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.