Patent Assignment
Reel/Frame 046416/0335
Assignment of Assignor's Interest
Recorded: 2018-07-20
Pages: 3
Assignors
SU, CHIA-WEI
Executed: 2018-07-10
YEN, FU-TING
Executed: 2018-07-06
TSAI, TENG-CHUN
Executed: 2018-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Structure