IP Library › Assignment 046422/0710
Patent Assignment
Reel/Frame 046422/0710

Assignment of Assignor's Interest

Recorded: 2018-06-25 Pages: 3
Assignor
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Method and Device for Determining Junction Temperature of Die of Semiconductor Power Module
Application: 16/064,379 →
Publication: US 2018/0372553
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2018
From: EWANCHUK, JEFFREY; MOLLOV, STEFAN; ROBINSON, JONATHAN; BRANDELERO, JULIO
To: MITSUBISHI ELECTRIC R&D CENTRE EUROPE B.V.
Reel/Frame 046422/0681 →