IP Library › Assignment 046428/0685
Patent Assignment
Reel/Frame 046428/0685

Assignment of Assignor's Interest

Recorded: 2018-07-23 Pages: 6
Assignors
LIN, WEI
Executed: 2014-04-30
SKORDAS, SPYRIDON
Executed: 2014-04-28
YOUNG, ROBERT R., JR.
Executed: 2014-04-29
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Gas-Controlled Bonding Platform for Edge Defect Reduction During Wafer Bonding
Application: 16/042,331 →
Publication: US 2018/0350639
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052557/0327 →