Patent Assignment
Reel/Frame 046428/0698
Assignment of Assignor's Interest
Recorded: 2018-07-23
Pages: 3
Assignors
HILL, MICHAEL J.
Executed: 2018-07-17
DO, HUONG T.
Executed: 2018-07-17
AUGUSTINE, ANNE
Executed: 2018-07-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate Inductor Having Thermal Interconnect Structures