Patent Assignment
Reel/Frame 046438/0107
Assignment of Assignor's Interest
Recorded: 2018-07-24
Pages: 7
Assignors
JEON, IL JUN
Executed: 2018-06-12
UH, JI HO
Executed: 2018-06-18
LEE, JE HAK
Executed: 2018-06-12
LEE, JUN SUNG
Executed: 2018-06-12
IM, JI WOON
Executed: 2018-06-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Support Unit and Deposition Apparatus Including the Same