Assignment of Assignor's Interest

Recorded: 2018-07-24 Pages: 6

Assignors

SEKI, TOSHITAKE

Executed: 2018-07-06

TAKAGI, YUTAKA

Executed: 2018-07-09

HORIO, TOSHIKAZU

Executed: 2018-07-09

SUGIMOTO, ATSUHIKO

Executed: 2018-07-09

Assignee

AGC INC.

5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN

Covered Property (1)

Glass Panel for Wiring Board and Method of Manufacturing Wiring Board

Patent: 10,470,300 →

Application: 16/043,982 →