IP Library Assignment 046489/0638
Patent Assignment
Reel/Frame 046489/0638

Merger

Recorded: 2018-07-03 Pages: 39
Assignor
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2 MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Method of Manufacturing Molding Material, Molding Die for Use in the Manufacturing Method, and Method of Manufacturing Resin Rotator
Application: 14/901,756 →
Publication: US 2016/0200004
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2015
From: OZAWA, MASAYA; SUGIYAMA, MASAO; FUKAO, TAKESHI
To: SHIN-KOBE ELECTRIC MACHINERY CO., LTD.
Reel/Frame 037374/0109 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →