Assignment of Assignor's Interest

Recorded: 2018-07-05 Pages: 3

Assignor

Executed: 2018-06-16

Assignee

MITSUBISHI ELECTRIC CORPORATION

7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN

Covered Property (1)

Method and Device for Estimating Level of Damage or Lifetime Expectation of Power Semiconductor Module

Patent: 10,782,338 →

Application: 16/067,860 →

Publication: US 2019/0331729

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.