Patent Assignment
Reel/Frame 046505/0878
Assignment of Assignor's Interest
Recorded: 2018-07-30
Pages: 5
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Polishing Apparatus and Method