IP Library › Assignment 046508/0989
Patent Assignment
Reel/Frame 046508/0989

Assignment of Assignor's Interest

Recorded: 2018-07-31 Pages: 3
Assignors
PODZEMNY, MARTIN
Executed: 2018-07-31
PEROUTKA, VACLAV
Executed: 2018-07-31
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Method of Forming a Semiconductor Device
Application: 16/029,917 →
Publication: US 2019/0013726
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →