IP Library Assignment 047399/0631
Patent Assignment
Reel/Frame 047399/0631

Security Interest

Recorded: 2018-11-01 Pages: 17
Assignors
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NEW YORK, 10005
Covered Properties (121)
Process of Forming an Electronic Device Including an Access Region
Application: 16/025,085 →
Publication: US 2020/0006521
Circuit and Electronic Device Including an Enhancement-Mode Transistor
Application: 16/026,897 →
Publication: US 2020/0013886
Tunable/De-Tunable Wireless Power Resonator System and Related Methods
Application: 16/029,444 →
Publication: US 2018/0316228
Method of Forming a Semiconductor Device
Application: 16/029,917 →
Publication: US 2019/0013726
Semiconductor Package with Grounding Device and Related Methods
Application: 16/031,948 →
Publication: US 2019/0122963
Methods and Systems of Peak Primary Current Control on the Secondary Side
Application: 16/032,323 →
Publication: US 2020/0021197
Methods and Apparatus for Increased Dynamic Range of an Image Sensor
Application: 16/032,957 →
Publication: US 2020/0021754
Power Conversion Efficiency Using Variable Switching Frequency
Application: 16/034,169 →
Publication: US 2018/0337608
Power Converter and Method of Entering Skip at a Fixed Output Power in a Light Load Condition Independent of Magnetizing Inductance
Application: 16/034,195 →
Publication: US 2018/0323716
Semiconductor Device and Method of Forming Backside Openings for an Ultra-Thin Semiconductor Die
Application: 16/035,838 →
Publication: US 2018/0323153
Active Clamp Power Converter and Method of Reducing Shoot-Through Current During Soft Start
Application: 16/035,855 →
Publication: US 2018/0342946
Avalanche-Rugged Silicon Carbide (Sic) Power Device
Application: 16/035,883 →
Publication: US 2018/0342576
Semiconductor Component and Method of Manufacture
Application: 16/036,560 →
Publication: US 2018/0342448
Image Sensors with Predictive Pre-Charging Circuitry
Application: 16/037,202 →
Publication: US 2020/0029040
One Cycle Controlled Power Factor Correction Circuit
Application: 16/037,267 →
Publication: US 2019/0044435
Semiconductor Device and Method of Forming Curved Image Sensor Region Robust Against Buckling
Application: 16/038,422 →
Publication: US 2018/0331150
Switching Device Control with Second Assertion of Drive Signal During Conduction Phase
Application: 16/039,521 →
Publication: US 2018/0323719
Quasi-Resonant Valley Lockout Without Feedback Reference
Application: 16/039,926 →
Publication: US 2018/0351465
Chopper-Stabilized Amplifier with Analog-Driven Level Shifter
Application: 16/042,006 →
Publication: US 2019/0207573
Methods and Apparatus for High Dynamic Range Imaging
Application: 16/042,167 →
Publication: US 2019/0075263
Chip-On-Lead Semiconductor Device Packages with Electrically Isolated Signal Leads
Application: 16/045,275 →
Publication: US 2020/0035586
Trench Diode and Method of Forming the Same
Application: 16/045,411 →
Circuit and Method for Soft Shutdown of a Coil
Application: 16/045,469 →
Methods and Apparatus for Rotation Detection of a Brushed Dc Motor
Application: 16/050,220 →
Methods and Apparatus for Measuring the Remaining Capacity of a Battery
Application: 16/050,569 →
Publication: US 2018/0335478
Substrate Integrated Waveguide and Method for Manufacturing the Same
Application: 16/050,991 →
Publication: US 2020/0044303
Electronic Device Including a High Electron Mobility Transistor Including a Gate Electrode
Application: 16/052,041 →
Publication: US 2020/0044067
Carbon-Controlled Ohmic Contact Layer for Backside Ohmic Contact on a Silicon Carbide Power Semiconductor Device
Application: 16/052,876 →
Publication: US 2020/0044031
Method for Forming Trench Semiconductor Device Having Schottky Barrier Structure
Application: 16/053,400 →
Publication: US 2020/0044027
Transform Processors for Gradually Switching Between Image Transforms
Application: 16/053,992 →
Publication: US 2020/0045228
Stacked Image Sensor Capable of Simultaneous Integration of Electrons and Holes
Application: 16/054,025 →
Publication: US 2020/0043968
Chip Scale Package and Related Methods
Application: 16/054,067 →
Publication: US 2018/0342549
Bond-Over-Active Circuity Gallium Nitride Devices
Application: 16/054,254 →
Publication: US 2018/0350964
Power-On Reset Circuit and Under-Voltage Lockout Circuit Comprising the Same
Application: 16/057,589 →
Publication: US 2018/0351545
Control of Pulse Generator in Driving Control Device
Application: 16/057,992 →
Publication: US 2020/0052572
Short-Circuit Performance for Silicon Carbide Semiconductor Device
Application: 16/059,223 →
Variable-Frequency Sampling of Battery Voltage to Determine Fuel Gauge Power Mode
Application: 16/059,756 →
Publication: US 2018/0348839
Through-Substrate via Structure and Method of Manufacture
Application: 16/101,259 →
Publication: US 2018/0350733
Packaging Structure for a Sensor Having a Sealing Layer
Application: 16/101,567 →
Publication: US 2020/0052020
Methods and Apparatus for a Capacitive Sensor
Application: 16/102,099 →
Publication: US 2019/0004631
Circuits and Methods for Bi-Directional Data Communication Over Isolation Channels
Application: 16/102,910 →
Publication: US 2019/0068417
Electronic Device Packaging with Galvanic Isolation
Application: 16/102,922 →
Publication: US 2019/0067171
Multi-Chip Packaging Structure for an Image Sensor
Application: 16/103,128 →
Publication: US 2020/0058695
Stack Packaging Structure for an Image Sensor
Application: 16/103,135 →
Publication: US 2020/0058618
Semiconductor Component Having an Esd Protection Device
Application: 16/103,518 →
Publication: US 2018/0374931
Electronic Device Including a Transistor Having Structures with Different Characteristics
Application: 16/104,039 →
Publication: US 2019/0067266
Current Sensor Packages with Through Hole in Semiconductor
Application: 16/106,638 →
Publication: US 2020/0066970
Systems and Methods for Image Data Compression
Application: 16/106,708 →
Publication: US 2020/0065064
Agnostic Model of Semiconductor Devices and Related Methods
Application: 16/107,158 →
Publication: US 2019/0057175
Integrated Circuit with Capacitor in Different Layer Than Transmission Line
Application: 16/107,377 →
Publication: US 2019/0173148
Clamped Output Amplifier
Application: 16/108,344 →
Publication: US 2020/0067464
Cross-Coupled Charge-Pumps
Application: 16/108,949 →
Methods and Systems of Operating Buck-Boost Converters
Application: 16/109,016 →
Publication: US 2020/0067411
Method of Forming a Conversion Circuit and Structure Therefor
Application: 16/111,880 →
Semiconductor Device Having Optimized Drain Termination and Method Therefor
Application: 16/111,931 →
Publication: US 2020/0066838
Devices, Systems and Methods for Determining and Compensating for Offset Errors Arising in Inductive Sensors
Application: 16/112,221 →
Publication: US 2020/0064159
Motor Driver with Multipurpose Pin
Application: 16/113,127 →
Publication: US 2018/0367068
Low Dropout (Ldo) Voltage Regulator with Soft-Start Circuit
Application: 16/113,973 →
Publication: US 2019/0146530
Motor Driver with Multipurpose Pin
Application: 16/114,455 →
Publication: US 2018/0364667
Process Variation as Die Level Traceability
Application: 16/114,674 →
Publication: US 2020/0075499
Image Sensor with Near-Infrared and Visible Light Pixels
Application: 16/116,380 →
Publication: US 2018/0366507
Stacked Image Sensor Capacitors and Related Methods
Application: 16/116,634 →
Publication: US 2019/0043903
Power Factor Correction Circuit and Method
Application: 16/117,341 →
Publication: US 2019/0013729
Methods and Systems for Wireless Audio
Application: 16/117,400 →
Publication: US 2020/0077175
Method for Adjusting a Drive Signal
Application: 16/120,826 →
Publication: US 2018/0375449
Electronic Device Including High Electron Mobility Transistors
Application: 16/123,115 →
Publication: US 2020/0083361
Methods and Systems of Operating a Resonant Dickson Converter
Application: 16/123,609 →
Image Sensor Pixels with Overflow Capabilities
Application: 16/123,700 →
Publication: US 2019/0020839
Low Turn-on Voltage Silicon Carbide Rectifiers
Application: 16/124,413 →
Publication: US 2020/0083365
Image Sensors with Multipart Diffractive Lenses
Application: 16/125,479 →
Electro-Static Discharge (Esd) Protection Clamp Technology
Application: 16/125,839 →
Publication: US 2019/0097419
Circuit That Changes Voltage of Back Electrode of Transistor Based on Error Condition
Application: 16/125,921 →
Publication: US 2020/0083214
Carrier Tape with Standoff Units
Application: 16/126,614 →
Publication: US 2019/0002173
Semiconductor Wafer and Method of Wafer Thinning
Application: 16/126,717 →
Publication: US 2019/0006169
Method of Forming a Semiconductor Device
Application: 16/126,877 →
Publication: US 2020/0083231
Trench Mosfet Contacts
Application: 16/128,139 →
Publication: US 2020/0083366
Electronic Device Including an Insulated Gate Bipolar Transistor Having a Field-Stop Region and a Process of Forming the Same
Application: 16/128,267 →
Reduced Voltage Switching of a Main Switch in Flyback Power Converters
Application: 16/128,324 →
Publication: US 2020/0083811
Damaging Components with Defective Electrical Couplings
Application: 16/128,353 →
Publication: US 2019/0013249
Line Ripple Reducer
Application: 16/128,650 →
Publication: US 2019/0159308
Pulse Width Demodulator
Application: 16/128,681 →
Publication: US 2020/0083876
Systems and Methods for Fault Detection in Image Sensor Processors
Application: 16/128,708 →
Publication: US 2020/0084437
Methods and Apparatus for a 3-Dimensional Capacitive Sensor Having Multi-Operation Electrodes
Application: 16/128,745 →
Publication: US 2019/0012019
Power Factor Correction Circuit with Calculated Duty Compensation and Driving Method Thereof
Application: 16/128,916 →
Publication: US 2019/0028022
Efficient Closed Loop Tuning Using Signal Strength
Application: 16/129,559 →
Publication: US 2019/0014605
Imaging Pixels with Non-Destructive Readout Capabilities
Application: 16/130,118 →
Publication: US 2020/0092502
Die Bonding to a Board
Application: 16/130,835 →
Publication: US 2019/0013308
Stacked Semiconductor Device Structure and Method
Application: 16/131,331 →
Publication: US 2019/0013264
Wire Bonding Systems and Related Methods
Application: 16/131,401 →
Publication: US 2019/0013290
Semiconductor Device and Method of Forming Micro Interconnect Structures
Application: 16/131,462 →
Publication: US 2019/0013265
Electrostatic Discharge Handling for Lateral Transistor Devices
Application: 16/132,545 →
Publication: US 2020/0091137
Methods of Reducing Wafer Thickness
Application: 16/133,063 →
Publication: US 2019/0019667
Thinned Semiconductor Wafer
Application: 16/133,178 →
Publication: US 2019/0019668
Insulated Gate Semiconductor Device Having Trench Termination Structure and Method
Application: 16/134,598 →
Publication: US 2019/0115436
Power Device with Multiple Field Stop Layers
Application: 16/134,742 →
Publication: US 2019/0019879
Electronic Device Including an Insulating Structure
Application: 16/134,936 →
Publication: US 2019/0035886
Automatic Control of Synchronous Rectifier Turn-Off Threshold
Application: 16/135,166 →
Publication: US 2019/0020283
Tape Heating Methods
Application: 16/136,021 →
Publication: US 2020/0090974
Jet Ablation Die Singulation Systems and Related Methods
Application: 16/136,026 →
Publication: US 2020/0091000
Imaging Systems with Sub-Radix-2 Charge Sharing Successive Approximation Register (Sar) Analog-to-Digital Converters
Application: 16/137,876 →
Methods and Apparatus for in-Place Fast Fourier Transform
Application: 16/139,339 →
Publication: US 2020/0097519
Reducing Mosfet Body Current
Application: 16/140,864 →
Publication: US 2019/0067473
Semiconductor Die Singulation Methods
Application: 16/141,019 →
Publication: US 2019/0080965
Electronic Device Including a Transistor and a Variable Capacitor
Application: 16/141,557 →
Publication: US 2020/0098745
Narrow-Mesa Super-Junction Mosfet
Application: 16/141,761 →
Publication: US 2020/0098857
Phase Detection Pixels with Diffractive Lenses
Application: 16/142,231 →
Publication: US 2020/0098812
Adaptive Gate Driver
Application: 16/142,256 →
Micromachined Multi-Axis Gyroscopes with Reduced Stress Sensitivity
Application: 16/143,772 →
Publication: US 2019/0145772
Active Reflector with Oscillation Inhibition
Application: 16/144,115 →
Publication: US 2020/0103494
Semiconductor Device and Method for Supporting Ultra-Thin Semiconductor Die
Application: 16/144,750 →
Publication: US 2019/0035687
Connecting Clip Design for Pressure Sintering
Application: 16/145,517 →
Publication: US 2020/0105648
Fan-Out Wafer Level Packaging of Semiconductor Devices
Application: 16/145,783 →
Publication: US 2020/0105700
Semiconductor Device Assemblies Including Spacer with Embedded Semiconductor Die
Application: 16/145,918 →
Publication: US 2020/0105706
System and Method for Bidirectional Current Sense Circuits
Application: 62/699,043 →
Alci Auto Monitoring Circuit
Application: 62/713,925 →
Semiconductor Sensors with Charge Dissipation Layer and Related Methods
Application: 62/717,658 →
Inductive Topology for a Lidar Driver
Application: 62/720,833 →
SiC MOSFET Semiconductor Packages and Related Methods
Application: 62/733,793 →
Power Modules and Related Methods
Application: 62/736,521 →
Ignition with Circulating Current Control
Application: 62/736,601 →
Image Sensor with Selective Pixel Binning
Application: 62/738,072 →
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 2, 2018
From: BANERJEE, ABHISHEK; VANMEERBEEK, PIET; MOENS, PETER; TACK, MARNIX
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046250/0913 →
Assignment of Assignor's Interest Jul 3, 2018
From: JEON, WOOCHUL; VENKATRAMAN, PRASAD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046262/0511 →
Assignment of Assignor's Interest Jul 6, 2018
From: AHMED, ABDULLAH; WEALE, GARETH PRYCE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046285/0424 →
Assignment of Assignor's Interest Jul 10, 2018
From: PRAJUCKAMOL, ATAPOL; WANG, SW; TAN, KAI CHAT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046312/0013 →
Assignment of Assignor's Interest Jul 11, 2018
From: BORTHAKUR, SWARNAL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046324/0282 →
Assignment of Assignor's Interest Jul 11, 2018
From: HARI, AJAY KARTHIK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046318/0458 →
Assignment of Assignor's Interest Jul 12, 2018
From: HARI, AJAY KARTHIK; MCCOY, BRYAN WAYNE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046338/0052 →
Assignment of Assignor's Interest Jul 12, 2018
From: HARI, AJAY KARTHIK; CHOPRA, DHRUV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046337/0941 →
Assignment of Assignor's Interest Jul 16, 2018
From: KONSTANTINOV, ANDREI
To: TRANSIC AB
Reel/Frame 046357/0217 →
Assignment of Assignor's Interest Jul 16, 2018
From: VENKATRAMAN, PRASAD; PADMANABHAN, BALAJI; SALIH, ALI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046362/0147 →
Assignment of Assignor's Interest Jul 16, 2018
From: GRIVNA, GORDON M.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046356/0501 →
Assignment of Assignor's Interest Jul 16, 2018
From: MCCOY, BRYAN WAYNE; HARI, AJAY KARTHIK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046356/0805 →
Assignment of Assignor's Interest Jul 16, 2018
From: TRANSIC AB
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 046357/0360 →
Assignment of Assignor's Interest Jul 17, 2018
From: JOHNSON, RICHARD SCOTT; GILHOTRA, PAWAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046368/0590 →
Assignment of Assignor's Interest Jul 17, 2018
From: KIM, JINTAE; MOON, SANGCHEOL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046375/0597 →
Assignment of Assignor's Interest Jul 18, 2018
From: BOETTIGER, ULRICH; SULFRIDGE, MARC ALLEN; PERKINS, ANDREW EUGENE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046381/0724 →
Assignment of Assignor's Interest Jul 19, 2018
From: PTACEK, KAREL; TICHY, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046398/0061 →
Assignment of Assignor's Interest Jul 31, 2018
From: PODZEMNY, MARTIN; PEROUTKA, VACLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046508/0989 →
Assignment of Assignor's Interest Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →
Security Interest Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →