IP Library Granted Patent US 10,430,008
Granted Patent B2
US 10,430,008 · App. 16/128,745 · Granted Oct 1, 2019

Methods and apparatus for a 3-dimensional capacitive sensor having multi-operation electrodes

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Quick Facts
Patent No.
US 10,430,008
App. No.
16/128,745
Granted
Oct 1, 2019
Kind
B2
Abstract

Various embodiments of the present technology may comprise methods and apparatus for a 3-dimensional capacitive sensor. The method and apparatus may comprise a sensing element formed along multiple planes to create a sensing field. The capacitive sensor comprises two sensing planes in communication with each other. Each sensing plane may comprise a multi-operation electrode, where the multi-operation electrode is configured to operate as a transmission electrode and a reception electrode.

Claims (66)

1. A 3-dimensional capacitive sensor, comprising:

a first multi-operation electrode; and

a second multi-operation electrode placed in communication with the first multi-operation electrode;

wherein each multi-operation electrode is selectively connected to both:

an amplifier, and

a voltage source.

2. The 3-dimensional capacitive sensor according to claim 1 , wherein each multi-operation electrode is configured to operate as one of a reception electrode and a transmission electrode.

3. The 3-dimensional capacitive sensor according to claim 1 , wherein:

the first multi-operation electrode is positioned on a first plane; and

the second multi-operation electrode is positioned on a second plane.

4. The 3-dimensional capacitive sensor according to claim 3 , wherein the first plane is substantially perpendicular to the second plane.

5. The 3-dimensional capacitive sensor according to claim 1 , wherein:

the first multi-operation electrode is positioned on a first plane; and

a first portion of the second multi-operation electrode is positioned on the first plane and a second portion of the second multi-operation electrode is positioned on a second plane.

6. The 3-dimensional capacitive sensor according to claim 5 , wherein the first plane is substantially perpendicular to the second plane.

7. The 3-dimensional capacitive sensor according to claim 1 , further comprising:

a first switching device connected to the first multi-operation electrode and configured to selectively connect the first multi-operation electrode to one of the amplifier and the voltage source; and

a second switching device connected to the second multi-operation electrode and configured to selectively connect the second multi-operation electrode to one of the amplifier and the voltage source.

8. The 3-dimensional capacitive sensor according to claim 1 , further comprising processing circuitry connected to the first and second multi-operation electrodes and configured to:

measure a capacitance between the first and second multi-operation electrodes; and

convert the measured capacitance to a volume.

9. A method for detecting volume with a capacitive sensor, comprising:

forming an electric field between a first sensing electrode and a second sensing electrode; wherein:

each sensing electrode is selectively operable as:

a reception electrode; and

a transmission electrode; and

each sensing electrode is selectively connected to both:

an amplifier; and

a voltage source;

operating:

the first sensing electrode as the reception electrode; and

the second sensing electrode as the transmission electrode;

measuring a capacitance formed between the first and second sensing electrodes; and

converting the measured capacitance to a volume.

10. The method according to claim 9 , wherein:

the first sensing electrode is positioned on a first plane; and

the second sensing electrode is positioned on a second plane.

11. The method according to claim 10 , wherein the second sensing electrode is positioned substantially perpendicular to the first sensing electrode.

12. The method according to claim 9 , wherein:

the first sensing electrode is positioned on a first plane; and

a first portion of the second sensing electrode is positioned on the first plane and a second portion of the second sensing electrode is positioned on a second plane.

13. The method according to claim 12 , wherein the first plane is substantially perpendicular to the second plane.

14. A capacitive sensor system, comprising:

a sensing element comprising:

a sensing capacitor, comprising:

a first multi-operation electrode; and

a second multi-operation electrode in communication with the first multi-operation electrode;

an integrated circuit coupled to the sensing element and configured to selectively operate each multi-operation electrode as one of:

a reception electrode; and

a transmission electrode;

wherein each multi-operation electrode is selectively connected to both:

an amplifier; and

a voltage source;

processing circuitry connected to the integrated circuit and configured to:

measure a capacitance between the first and second multi-operation electrodes; and

convert the measured capacitance to a volume.

15. The capacitive sensor system according to claim 14 , wherein:

the first multi-operation electrode is positioned on a first plane; and

the second multi-operation electrode is positioned on a second plane.

16. The capacitive sensor system according to claim 15 , wherein the second multi-operation electrode is positioned substantially perpendicular to the first multi-operation electrode.

17. The capacitive sensor system according to claim 14 , wherein:

the first multi-operation electrode is positioned on a first plane; and

a first portion of the second multi-operation electrode is positioned on the first plane and a second portion of the second multi-operation electrode is positioned on a second plane.

18. The capacitive sensor system according to claim 17 , wherein the first plane is substantially perpendicular to the second plane.

19. The capacitive sensor system according to claim 14 , wherein the integrated circuit comprises a switching device to selectively connect each multi-operation electrode to one of: an amplifier and a voltage source.

20. The capacitive sensor system according to claim 14 , wherein the first multi-operation electrode is positioned on a first outside surface of a sidewall of a container and at least a portion of the second multi-operation electrode is positioned on a second outside surface of a bottom of the container.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 047399, FRAME 0631 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →
SECURITY INTEREST Recorded Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2018
From: OTAGAKI, TAKAYASU; GOTO, KENSUKE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 046849/0445 →