Semiconductor device and method of forming micro interconnect structures
A semiconductor device has a first semiconductor die and second semiconductor die with a conductive layer formed over the first semiconductor die and second semiconductor die. The second semiconductor die is disposed adjacent to the first semiconductor die with a side surface and the conductive layer of the first semiconductor die contacting a side surface and the conductive layer of the second semiconductor die. An interconnect, such as a conductive material, is formed across a junction between the conductive layers of the first and second semiconductor die. The conductive layer may extend down the side surface of the first semiconductor die and further down the side surface of the second semiconductor die. An extension of the side surface of the first semiconductor die can interlock with a recess of the side surface of the second semiconductor die. The conductive layer extends over the extension and into the recess.
1. A semiconductor device, comprising:
a first semiconductor die comprising an active surface and one or more side surfaces substantially perpendicular to the active surface;
an extension in each of the one or more side surfaces of the first semiconductor die;
a second semiconductor die comprising an active surface and a side surface substantially perpendicular to the active surface;
a recess in the side surface of the second semiconductor die;
a first conductive layer formed on a portion of the active surface and the extension in each of the one or more side surfaces of the first semiconductor die;
a second conductive layer formed on a portion of the active surface and the recess of the second semiconductor die; and
an interconnect formed over the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die;
wherein the extension of the first semiconductor die is disposed into the recess in the second semiconductor die to interlock the first semiconductor die and second semiconductor die.
2. The semiconductor device of claim 1 , wherein the interconnect includes a conductive material formed over a junction between the first conductive layer of the first semiconductor die and the second conductive layer of the second semiconductor die.
3. The semiconductor device of claim 1 , wherein the first semiconductor die has more than four side surfaces.
4. The semiconductor device of claim 1 , wherein the first semiconductor die includes a polygonal shape.
5. The semiconductor device of claim 1 , wherein the extension has an angled profile and the recess has an angled profile.
6. The semiconductor device of claim 1 , wherein the side surfaces are angled.
7. The semiconductor device of claim 1 , further including a third semiconductor die comprising an active surface and a side surface substantially perpendicular to the active surface and comprising a third conductive layer comprised over a portion of the active surface and the side surface.
8. The semiconductor of claim 1 , wherein the third semiconductor die is mechanically and electrically coupled to the first semiconductor die through the first conductive layer and the third conductive layer.